Towards virtually optimized curing cycles for polymeric encapsulations in microelectronics

Christian Schipfer, Mario Gschwandl, Peter Fuchs, Thomas Antretter, Michael Feuchter, Matthias Morak, Qi Tao, Angelika Schingale

Research output: Contribution to journalArticleResearchpeer-review

Original languageEnglish
Article number114799
JournalMicroelectronics Reliability
Volume139
DOIs
Publication statusPublished - Dec 2022

Bibliographical note

Publisher Copyright:
© 2022 Elsevier Ltd

Keywords

  • Curing simulation
  • D2PAK
  • Finite-element-simulation
  • Heating cycle
  • Process optimization
  • Residual stresses

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