Temperature Profile in Rubber Injection Molding: Application of a Recently Developed Testing Method to Improve the Process Simulation and Calculation of Curing Kinetics

Martin Traintinger, Kerschbaumer Roman Christopher, Bernhard Lechner, Walter Friesenbichler, Thomas Lucyshyn

Research output: Contribution to journalArticleResearchpeer-review

Abstract

Injection molding of rubber compounds is an easily conducted yet sophisticated method for rubber processing. Simulation software is used to examine the optimal process conditions, identify failure scenarios, and save resources. Due to the complexity of the entire process, various aspects have to be considered in the numerical approach. This contribution focused on a comparison of process simulations with various definitions of the material’s inlet temperature, ranging from a stepwise increase, but constant temperature, to an exact axial mass temperature profile prior to injection. The latter was obtained with a specially designed, unique test stand consisting of a plasticizing cylinder equipped with pressure sensors, a throttle valve for pressure adjustments, and a measurement bar with thermocouples for the determination of the actual state of the mass temperature. For the verification of the theoretical calculations, practical experiments were conducted on a rubber injection molding machine equipped with the mold used in the simulation. The moldings, obtained at different vulcanization time, were characterized mechanically and the results were normalized to a relative degree of cure in order to enable comparison of the real process and the simulation. Considering the actual state of the mass temperature, the simulation showed an excellent correlation of the measured and calculated mass temperatures in the cold runner. Additionally, the relative degree of cure was closer to reality when the mass temperature profile after dosing was applied in the simulation.
Original languageEnglish
Article number380
Pages (from-to)1-12
Number of pages12
JournalPolymers
Volume13.2021
Issue number3
DOIs
Publication statusPublished - 26 Jan 2021

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