Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films

H. Turnow; H. Wendrock; S. Menzel; T. Gemming; J. Eckert

doi:10.1016/j.tsf.2015.10.081

Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films

H. Turnow, H. Wendrock, S. Menzel, T. Gemming, J. Eckert

Chair of Materials Physics (430)

Research output: Contribution to journal › Article › Research › peer-review

6 Citations (Scopus)

Original language	English
Pages (from-to)	184-188
Number of pages	5
Journal	Thin solid films
Volume	598
DOIs	https://doi.org/10.1016/j.tsf.2015.10.081
Publication status	Published - 1 Jan 2016

Keywords

Amorphous
Cu-Ti
Intrinsic stress
Sputtering
Thin film

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10.1016/j.tsf.2015.10.081

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title = "Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films",

keywords = "Amorphous, Cu-Ti, Intrinsic stress, Sputtering, Thin film",

author = "H. Turnow and H. Wendrock and S. Menzel and T. Gemming and J. Eckert",

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month = jan,

day = "1",

doi = "10.1016/j.tsf.2015.10.081",

language = "English",

volume = "598",

pages = "184--188",

journal = "Thin solid films",

issn = "0040-6090",

publisher = "Elsevier",

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TY - JOUR

T1 - Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films

AU - Turnow, H.

AU - Wendrock, H.

AU - Menzel, S.

AU - Gemming, T.

AU - Eckert, J.

PY - 2016/1/1

Y1 - 2016/1/1

KW - Amorphous

KW - Cu-Ti

KW - Intrinsic stress

KW - Sputtering

KW - Thin film

UR - http://www.scopus.com/inward/record.url?scp=84959105019&partnerID=8YFLogxK

U2 - 10.1016/j.tsf.2015.10.081

DO - 10.1016/j.tsf.2015.10.081

M3 - Article

AN - SCOPUS:84959105019

SN - 0040-6090

VL - 598

SP - 184

EP - 188

JO - Thin solid films

JF - Thin solid films

ER -

Structure and properties of sputter deposited crystalline and amorphous Cu-Ti films

Keywords

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