Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing

R. Huang, W. Robl, H. Ceric, T. Detzel, Gerhard Dehm

Research output: Contribution to journal › Article › Research › peer-review

48 Citations (Scopus)

Translated title of the contribution	Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing
Original language	English
Pages (from-to)	47-54
Journal	IEEE transactions on device and materials reliability
Volume	10
Issue number	1
DOIs	https://doi.org/10.1109/TDMR.2009.2032768
Publication status	Published - 2010

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author = "R. Huang and W. Robl and H. Ceric and T. Detzel and Gerhard Dehm",

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T1 - Stress, Sheet Resistance, and Microstructure Evolution of Electroplated Cu Films During Self-Annealing

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AU - Robl, W.

AU - Ceric, H.

AU - Detzel, T.

AU - Dehm, Gerhard

PY - 2010

Y1 - 2010

U2 - 10.1109/TDMR.2009.2032768

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JF - IEEE transactions on device and materials reliability

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