Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards

Katerina Macurova, Paul Angerer, Thomas Antretter, Raul Bermejo Moratinos, Wilson Maia, Ronald Schöngrundner, Thomas Krivec, Mike Morianz, Michel Brizoux

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)
Original languageEnglish
Title of host publicationProceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
PublisherG.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger
ISBN (Print)978-1-4799-4791-1
Publication statusPublished - 2014

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