Numerical investigation of the process of embedding components into printed circuit boards

Martin Pletz, Raul Bermejo, Peter Supancic, Johannes Stahr, Mike Morianz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)
Original languageEnglish
Title of host publication2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011
DOIs
Publication statusPublished - 2011
Event2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011 - Linz, Austria
Duration: 18 Apr 201120 Apr 2011

Conference

Conference2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011
Country/TerritoryAustria
CityLinz
Period18/04/1120/04/11

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