Multi-physics simulation of the component attachment within embedding process

Katerina Macurova, A. Kharicha, M. Pletz, M. Mataln, Raul Bermejo, R. Schongrundner, T. Krivec, T. Antretter, W. Maia, M. Morianz, M. Brizoux

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)
Original languageEnglish
Title of host publication14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2013
PublisherInstitute of Electrical and Electronics Engineers Inc.
Number of pages6
ISBN (Print)978-1-4673-6138-5
Publication statusPublished - 1 Apr 2013
EventEuroSimE 2013 - Wroclaw, Poland
Duration: 15 Apr 201317 Apr 2013


ConferenceEuroSimE 2013
Abbreviated titleEuroSimE 2013


  • adhesives
  • circuit complexity
  • formal verification
  • printed circuits
  • PCB complexity
  • adhesive thickness
  • commercial program Ansys FLUENT
  • component attachment
  • embedding process
  • model validation
  • multiphysics simulation
  • numerical model
  • printed circuit boards complexity
  • Abstracts
  • Analytical models
  • Copper
  • Differential equations
  • Numerical models
  • Reliability

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