Microstructural Effects on the Interfacial Adhesion of Nanometer-Thick Cu Films on Glass Substrates: Implications for Microelectronic Devices

Alice Lassnig, Velislava L. Terziyska, Jakub Zalesak, Tanja Jörg, Daniel M. Toebbens, Thomas Griesser, Christian Mitterer, Reinhard Pippan, Megan J. Cordill

Research output: Contribution to journalArticleResearchpeer-review

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)61-70
Number of pages10
JournalACS Applied Nano Materials
Issue number1
Publication statusPublished - 22 Jan 2021

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© 2020 American Chemical Society.


  • brittle-ductile interface
  • film microstructure
  • nanosized Cu films
  • spontaneous buckles
  • thin film adhesion

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