Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices

A. Lassnig; Velislava Terziyska; Jakub Zalesak; Tanja Jörg; Daniel Többens; Thomas Griesser; Christian Mitterer; Reinhard Pippan; Megan Cordill

doi:10.1021/acsanm.0c02182

Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices

A. Lassnig, Velislava Terziyska, Jakub Zalesak, Tanja Jörg, Daniel Többens, Thomas Griesser, Christian Mitterer, Reinhard Pippan, Megan Cordill

Research output: Contribution to journal › Article › Research › peer-review

1 Citation (Scopus)

Original language	English
Pages (from-to)	61-70
Journal	ACS Applied Nano Materials
Volume	2021
Issue number	4
DOIs	https://doi.org/10.1021/acsanm.0c02182
Publication status	Published - 2021

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10.1021/acsanm.0c02182

Cite this

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title = "Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices",

author = "A. Lassnig and Velislava Terziyska and Jakub Zalesak and Tanja J{\"o}rg and Daniel T{\"o}bbens and Thomas Griesser and Christian Mitterer and Reinhard Pippan and Megan Cordill",

year = "2021",

doi = "10.1021/acsanm.0c02182",

language = "English",

volume = "2021",

pages = "61--70",

journal = "ACS Applied Nano Materials",

issn = "2574-0970",

publisher = "American Chemical Society",

number = "4",

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TY - JOUR

T1 - Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices

AU - Lassnig, A.

AU - Terziyska, Velislava

AU - Zalesak, Jakub

AU - Jörg, Tanja

AU - Többens, Daniel

AU - Griesser, Thomas

AU - Mitterer, Christian

AU - Pippan, Reinhard

AU - Cordill, Megan

PY - 2021

Y1 - 2021

U2 - 10.1021/acsanm.0c02182

DO - 10.1021/acsanm.0c02182

M3 - Article

SN - 2574-0970

VL - 2021

SP - 61

EP - 70

JO - ACS Applied Nano Materials

JF - ACS Applied Nano Materials

IS - 4

ER -