Microstructural effects on the interfacial adhesion of nanometer- thick Cu films on glass substrates: Implications for microelectronic devices

A. Lassnig, Velislava Terziyska, Jakub Zalesak, Tanja Jörg, Daniel Többens, Thomas Griesser, Christian Mitterer, Reinhard Pippan, Megan Cordill

Research output: Contribution to journalArticleResearchpeer-review

1 Citation (Scopus)
Original languageEnglish
Pages (from-to)61-70
JournalACS Applied Nano Materials
Issue number4
Publication statusPublished - 2021

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