Translated title of the contribution | Method development for the cyclic characterization of thin copper layers for PCB applications |
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Original language | English |
Pages (from-to) | 53-60 |
Journal | Circuit World |
Volume | 40 |
DOIs | |
Publication status | Published - 2014 |
Method development for the cyclic characterization of thin copper layers for PCB applications
Klaus Fellner, Peter Filipp Fuchs, Gerald Pinter, Thomas Antretter, Thomas Krivec
Research output: Contribution to journal › Article › Research › peer-review
7
Citations
(Scopus)