Investigation of high cyclic fatigue behaviour of thin copper films using MEMS structure

F. Saghaeian, M. Lederer, A. Hofer, J. Todt, J. Keckes, G. Khatibi

    Research output: Contribution to journalArticleResearchpeer-review

    5 Citations (Scopus)
    Original languageEnglish
    Article number105179
    JournalInternational Journal of Fatigue
    Volume128
    DOIs
    Publication statusPublished - 1 Nov 2019

    Keywords

    • Electronic material
    • High cycle fatigue
    • MEMS
    • Microstructures
    • Reliability

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