Influence of extreme thermal cycling on metal-polymer interfaces

Barbara Putz, Bernhard Völker, Christopher Semprimoschnig, Megan J. Cordill

Research output: Contribution to journalArticleResearchpeer-review

9 Citations (Scopus)
Original languageEnglish
Pages (from-to)17-22
Number of pages6
JournalMicroelectronic engineering
Volume167
DOIs
Publication statusPublished - 5 Jan 2017

Keywords

  • Adhesion
  • Buckling
  • Polymer
  • Thermal cycling
  • Thin film

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