Influence of environmental factors like temperature and humidity on MEMS packaging materials.

Mahesh Yalagach, Peter Filipp Fuchs, Ivaylo Mitev, Thomas Antretter, Michael Feuchter, Archim Wolfberger, Tao Qi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)
Original languageEnglish
Title of host publication2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781538668139
DOIs
Publication statusPublished - 26 Nov 2018
Event7th Electronic System-Integration Technology Conference, ESTC 2018 - Dresden, Germany
Duration: 18 Sept 201821 Sept 2018

Conference

Conference7th Electronic System-Integration Technology Conference, ESTC 2018
Country/TerritoryGermany
CityDresden
Period18/09/1821/09/18

Keywords

  • hygro-thermo-mechanical simulation
  • hygroscopic swelling
  • moisture diffusion
  • Thermo-mechanical characterization

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