Influence of cooling rate and annealing on the DSC Tg of an epoxy resin

Qi Tao, Gerald Pinter, Thomas Krivec

Research output: Contribution to journalArticleResearchpeer-review

2 Citations (Scopus)
Original languageEnglish
Pages (from-to)396-400
Number of pages5
JournalMicroelectronics Reliability
Volume78
DOIs
Publication statusPublished - 1 Nov 2017

Keywords

  • Annealing
  • Cooling rate
  • Curing pressure
  • Endothermic peak
  • Epoxy resin
  • Glass transition

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