Fracture mechanics of thin film systems on the sub-micron scale

Darjan Kozic; Ruth Treml; Ronald Schongrundner; Roland Brunner; Daniel Kiener; Johannes Zechner; Thomas Antretter; Hans Peter Ganser

doi:10.1109/EuroSimE.2015.7103088

Fracture mechanics of thin film systems on the sub-micron scale

Darjan Kozic, Ruth Treml, Ronald Schongrundner, Roland Brunner, Daniel Kiener, Johannes Zechner, Thomas Antretter, Hans Peter Ganser

Chair of Mechanics (400)

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Original language	English
Title of host publication	2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Print)	9781479999507
DOIs	https://doi.org/10.1109/EuroSimE.2015.7103088
Publication status	Published - 6 May 2015
Event	2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 - Budapest, Hungary Duration: 19 Apr 2015 → 22 Apr 2015

Conference

Conference	2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015
Abbreviated title	EuroSimE 2015
Country/Territory	Hungary
City	Budapest
Period	19/04/15 → 22/04/15

Access to Document

10.1109/EuroSimE.2015.7103088

Cite this

Kozic, D., Treml, R., Schongrundner, R., Brunner, R., Kiener, D., Zechner, J., Antretter, T., & Ganser, H. P. (2015). Fracture mechanics of thin film systems on the sub-micron scale. In 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 Article 7103088 Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EuroSimE.2015.7103088

@inproceedings{cc8103515a5f4a8bbc4df8f553d22bfa,

title = "Fracture mechanics of thin film systems on the sub-micron scale",

author = "Darjan Kozic and Ruth Treml and Ronald Schongrundner and Roland Brunner and Daniel Kiener and Johannes Zechner and Thomas Antretter and Ganser, {Hans Peter}",

year = "2015",

month = may,

day = "6",

doi = "10.1109/EuroSimE.2015.7103088",

language = "English",

isbn = "9781479999507",

booktitle = "2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

address = "United States",

note = "2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 ; Conference date: 19-04-2015 Through 22-04-2015",

}

Kozic, D, Treml, R, Schongrundner, R, Brunner, R, Kiener, D, Zechner, J, Antretter, T & Ganser, HP 2015, Fracture mechanics of thin film systems on the sub-micron scale. in 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015., 7103088, Institute of Electrical and Electronics Engineers Inc., 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015, Budapest, Hungary, 19/04/15. https://doi.org/10.1109/EuroSimE.2015.7103088

Fracture mechanics of thin film systems on the sub-micron scale. / Kozic, Darjan; Treml, Ruth; Schongrundner, Ronald et al.
2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers Inc., 2015. 7103088.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Fracture mechanics of thin film systems on the sub-micron scale

AU - Kozic, Darjan

AU - Treml, Ruth

AU - Schongrundner, Ronald

AU - Brunner, Roland

AU - Kiener, Daniel

AU - Zechner, Johannes

AU - Antretter, Thomas

AU - Ganser, Hans Peter

PY - 2015/5/6

Y1 - 2015/5/6

UR - http://www.scopus.com/inward/record.url?scp=84944810041&partnerID=8YFLogxK

U2 - 10.1109/EuroSimE.2015.7103088

DO - 10.1109/EuroSimE.2015.7103088

M3 - Conference contribution

AN - SCOPUS:84944810041

SN - 9781479999507

BT - 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015

Y2 - 19 April 2015 through 22 April 2015

ER -

Kozic D, Treml R, Schongrundner R, Brunner R, Kiener D, Zechner J et al. Fracture mechanics of thin film systems on the sub-micron scale. In 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015. Institute of Electrical and Electronics Engineers Inc. 2015. 7103088 doi: 10.1109/EuroSimE.2015.7103088

Fracture mechanics of thin film systems on the sub-micron scale

Conference

Access to Document

Other files and links

Cite this