Original language | English |
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Title of host publication | Proceedings of the 18th Electronics Packaging Technology Conference EPTC2016 |
Pages | 497-500 |
Publication status | Published - 2016 |
Finite element analysis of arbitrarily complex electronics devices
Mario Gschwandl, Peter Fuchs, Klaus Fellner, Thomas Antretter, Thomas Krivec, Qi Tao
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution