Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue

Stephan Bigl; Claus O.W. Trost; Stefan Wurster; Megan J. Cordill; Daniel Kiener

doi:10.1557/jmr.2017.199

Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue

Stephan Bigl, Claus O.W. Trost, Stefan Wurster, Megan J. Cordill, Daniel Kiener

Montanuniversität

Erich Schmid Institute of Materials Science

Research output: Contribution to journal › Article › Research › peer-review

3 Citations (Scopus)

Original language	English
Pages (from-to)	2022-2034
Number of pages	13
Journal	Journal of materials research (JMR)
Volume	32
Issue number	11
DOIs	https://doi.org/10.1557/jmr.2017.199
Publication status	Published - 14 Jun 2017

Keywords

fatigue
texture
thermal stresses

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10.1557/jmr.2017.199

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title = "Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue",

keywords = "fatigue, texture, thermal stresses",

author = "Stephan Bigl and Trost, {Claus O.W.} and Stefan Wurster and Cordill, {Megan J.} and Daniel Kiener",

year = "2017",

month = jun,

day = "14",

doi = "10.1557/jmr.2017.199",

language = "English",

volume = "32",

pages = "2022--2034",

journal = "Journal of materials research (JMR)",

issn = "0884-2914",

publisher = "Materials Research Society : MRS",

number = "11",

}

TY - JOUR

T1 - Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue

AU - Bigl, Stephan

AU - Trost, Claus O.W.

AU - Wurster, Stefan

AU - Cordill, Megan J.

AU - Kiener, Daniel

PY - 2017/6/14

Y1 - 2017/6/14

KW - fatigue

KW - texture

KW - thermal stresses

UR - http://www.scopus.com/inward/record.url?scp=85020723130&partnerID=8YFLogxK

U2 - 10.1557/jmr.2017.199

DO - 10.1557/jmr.2017.199

M3 - Article

AN - SCOPUS:85020723130

SN - 0884-2914

VL - 32

SP - 2022

EP - 2034

JO - Journal of materials research (JMR)

JF - Journal of materials research (JMR)

IS - 11

ER -

Film thickness dependent microstructural changes of thick copper metallizations upon thermal fatigue

Keywords

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