Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers

Marlene Mühlbacher; Grzegorz Greczynski; Bernhard  Sartory; Nina Schalk; Jun Lu; Ivan Petrov; J.E. Greene; Lars Hultman; Christian Mitterer

doi:10.1038/s41598-018-23782-9

Enhanced Ti_0.84Ta_0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers

Marlene Mühlbacher, Grzegorz Greczynski, Bernhard Sartory, Nina Schalk, Jun Lu, Ivan Petrov, J.E. Greene, Lars Hultman, Christian Mitterer

Research output: Contribution to journal › Article › Research › peer-review

14 Citations (Scopus)

Original language	English
Pages (from-to)	1-9
Journal	Scientific reports (London : Nature Publishing Group)
DOIs	https://doi.org/10.1038/s41598-018-23782-9
Publication status	Published - 2018

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10.1038/s41598-018-23782-9Licence: CC BY

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Mühlbacher, M., Greczynski, G., Sartory, B., Schalk, N., Lu, J., Petrov, I., Greene, J. E., Hultman, L., & Mitterer, C. (2018). Enhanced Ti_0.84Ta_0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers. Scientific reports (London : Nature Publishing Group), 1-9. https://doi.org/10.1038/s41598-018-23782-9

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title = "Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers",

author = "Marlene M{\"u}hlbacher and Grzegorz Greczynski and Bernhard Sartory and Nina Schalk and Jun Lu and Ivan Petrov and J.E. Greene and Lars Hultman and Christian Mitterer",

year = "2018",

doi = "10.1038/s41598-018-23782-9",

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Mühlbacher, M, Greczynski, G, Sartory, B, Schalk, N, Lu, J, Petrov, I, Greene, JE, Hultman, L & Mitterer, C 2018, 'Enhanced Ti_0.84Ta_0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers', Scientific reports (London : Nature Publishing Group), pp. 1-9. https://doi.org/10.1038/s41598-018-23782-9

Enhanced Ti_0.84Ta_0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers. / Mühlbacher, Marlene; Greczynski, Grzegorz; Sartory, Bernhard et al.
In: Scientific reports (London : Nature Publishing Group), 2018, p. 1-9.

Research output: Contribution to journal › Article › Research › peer-review

TY - JOUR

T1 - Enhanced Ti0.84Ta0.16N diffusion barriers, grown by a hybrid sputtering technique with no substrate heating, between Si (001) wafers and Cu overlayers

AU - Mühlbacher, Marlene

AU - Greczynski, Grzegorz

AU - Sartory, Bernhard

AU - Schalk, Nina

AU - Lu, Jun

AU - Petrov, Ivan

AU - Greene, J.E.

AU - Hultman, Lars

AU - Mitterer, Christian

PY - 2018

Y1 - 2018

U2 - 10.1038/s41598-018-23782-9

DO - 10.1038/s41598-018-23782-9

M3 - Article

SN - 2045-2322

SP - 1

EP - 9

JO - Scientific reports (London : Nature Publishing Group)

JF - Scientific reports (London : Nature Publishing Group)

ER -