Downscaling metal-dielectric interface fracture experiments to sub-micron dimensions: A feasibility study using TEM

B. Völker, W. Heinz, R. Roth, J. M. Batke, M. J. Cordill, G. Dehm

Research output: Contribution to journalArticleResearchpeer-review

7 Citations (Scopus)
Original languageEnglish
Pages (from-to)1-7
Number of pages7
JournalSurface & coatings technology
Publication statusPublished - 25 May 2015


  • Bending beam
  • In-situ TEM
  • Interface fracture
  • Submicron-sized samples

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