Design of multilayer metallization  to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers

Imane Souli; Velislava Terziyska; Jozef Keckes; Josef Zechner; Christian Mitterer

Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers

Imane Souli, Velislava Terziyska, Jozef Keckes, Josef Zechner, Christian Mitterer

Research output: Contribution to conference › Presentation › Research

Original language	English
Publication status	Published - 2016
Event	8th International Conference On Technological Advances Of Thin Films and Surface Coatings - Singapur, Singapore Duration: 12 Jul 2016 → 15 Jul 2016

Conference

Conference	8th International Conference On Technological Advances Of Thin Films and Surface Coatings
Abbreviated title	ThinFilms2016
Country/Territory	Singapore
City	Singapur
Period	12/07/16 → 15/07/16

8th International Conference On Technological Advances Of Thin Films and Surface Coatings
Imane Souli (Speaker)
12 Jul 2016 → 15 Jul 2016
Activity: Participating in or organising an event › Participation in conference

Cite this

Souli, I., Terziyska, V., Keckes, J., Zechner, J., & Mitterer, C. (2016). Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers . 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapore.

Souli, Imane ; Terziyska, Velislava ; Keckes, Jozef et al. / Design of multilayer metallization to reduce mechanical loading : Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers . 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapore.

@conference{e4d57ba6f325420e96a05ad406fd8a86,

title = "Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers ",

author = "Imane Souli and Velislava Terziyska and Jozef Keckes and Josef Zechner and Christian Mitterer",

year = "2016",

language = "English",

note = "8th International Conference On Technological Advances Of Thin Films and Surface Coatings ; Conference date: 12-07-2016 Through 15-07-2016",

}

Souli, I, Terziyska, V , Keckes, J, Zechner, J & Mitterer, C 2016, 'Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers ', 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapore, 12/07/16 - 15/07/16.

Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers . / Souli, Imane; Terziyska, Velislava ; Keckes, Jozef et al.
2016. 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapore.

Research output: Contribution to conference › Presentation › Research

Souli I, Terziyska V , Keckes J, Zechner J, Mitterer C. Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers . 2016. 8th International Conference On Technological Advances Of Thin Films and Surface Coatings, Singapur, Singapore.

Design of multilayer metallization to reduce mechanical loading: Effect of growth conditions on interface stability and thermo-mechanical properties of sputtered Cu films on Si with and without WTi barrier layers

Conference

Activities

8th International Conference On Technological Advances Of Thin Films and Surface Coatings

Cite this