Copper/epoxy joints in printed circuit boards: Manufacturing and interfacial failure mechanisms

Philipp Nothdurft; Gisbert Riess; Wolfgang Kern

doi:10.3390/ma12030550

Copper/epoxy joints in printed circuit boards: Manufacturing and interfacial failure mechanisms

Philipp Nothdurft, Gisbert Riess, Wolfgang Kern

Polymer Competence Center Leoben GmbH

Research output: Contribution to journal › Review article › peer-review

12 Citations (Scopus)

Original language	English
Article number	550
Journal	Materials
Volume	12
Issue number	3
DOIs	https://doi.org/10.3390/ma12030550
Publication status	Published - 12 Feb 2019

Keywords

Circuit boards
Copper/epoxy joints
Electronic industry
Failure analysis
Printed
State of the art

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10.3390/ma12030550

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keywords = "Circuit boards, Copper/epoxy joints, Electronic industry, Failure analysis, Printed, State of the art",

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journal = "Materials",

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T1 - Copper/epoxy joints in printed circuit boards

T2 - Manufacturing and interfacial failure mechanisms

AU - Nothdurft, Philipp

AU - Riess, Gisbert

AU - Kern, Wolfgang

PY - 2019/2/12

Y1 - 2019/2/12

KW - Circuit boards

KW - Copper/epoxy joints

KW - Electronic industry

KW - Failure analysis

KW - Printed

KW - State of the art

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U2 - 10.3390/ma12030550

DO - 10.3390/ma12030550

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SN - 1996-1944

VL - 12

JO - Materials

JF - Materials

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ER -

Copper/epoxy joints in printed circuit boards: Manufacturing and interfacial failure mechanisms

Keywords

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