Comparison of different methods for stress and deflection analysis in embedded die packages during the assembly process

K. Macurova, Raul Bermejo Moratinos, M. Pletz, R. Schöngrundner, T. Antretter, T. Krivec, M. Morianz, M. Brizoux, A. Lecavelier

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationProceedings - 2014 47th International Symposium on Microelectronics, IMAPS 2014
PublisherIMAPS-International Microelectronics and Packaging Society
Pages355-360
Number of pages6
ISBN (Print)9780990902805
Publication statusPublished - 1 Jan 2014
Event47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014 - San Diego, Austria
Duration: 13 Oct 201416 Oct 2014

Conference

Conference47th International Symposium on Microelectronics: Future of Packaging, IMAPS 2014
Country/TerritoryAustria
CitySan Diego
Period13/10/1416/10/14

Keywords

  • Assembly process
  • Classical laminate theory
  • Fea
  • Interfacial model
  • Residual stress
  • Warpage

Cite this