Characterization and modeling of the AuSnCu thin solder joint under thermal cycling

Thomas Antretter, Ralf Otremba, Balamurugan Karunamurthy, Tiphaine Pélisset

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish
Title of host publicationProceedings of the 15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014
PublisherG.Q. Zhang, W.D. Van Driel, P. Rodgers, C. Bailey, O. de Saint Leger
ISBN (Print)978-1-4799-4791-1
Publication statusPublished - 2014

Cite this