Carbon microparticles from organosolv lignin as filler for conducting Poly(lactic acid)

J. Köhnke, C. Fürst, C. Unterweger, H. Rennhofer, H.C. Lichtenegger, J. Keckes, G. Emsenhuber, A.R. Mahendran, F. Liebner, W. Gindl-Altmutter

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