3D simulation of interdendritic flow through a Al-18wt.%Cu structure captured with X-ray microtomography

Josef Domitner, Christian Hölzl, Abdellah Kharicha, Menghuai Wu, Andreas Ludwig, Markus Köhler, Lorenz Ratke

Research output: Contribution to conference › Poster › Research › peer-review

7 Citations (Scopus)

Translated title of the contribution	3D simulation of interdendritic flow through a Al-18wt.%Cu structure captured with X-ray microtomography
Original language	English
Publication status	Published - 2011
Event	Third International Conference on Advances in Solidification Processes (ICASP 3) - Rolduc Abbey, Kerkrade, Netherlands Duration: 7 Jun 2011 → 10 Jun 2011

Conference	Third International Conference on Advances in Solidification Processes (ICASP 3)
Abbreviated title	ICASP 3
Country/Territory	Netherlands
City	Kerkrade
Period	7/06/11 → 10/06/11

Cite this

@conference{874a81329822472eb5a03cf1e4c0809b,

title = "3D simulation of interdendritic flow through a Al-18wt.%Cu structure captured with X-ray microtomography",

author = "Josef Domitner and Christian H{\"o}lzl and Abdellah Kharicha and Menghuai Wu and Andreas Ludwig and Markus K{\"o}hler and Lorenz Ratke",

year = "2011",

language = "English",

note = "Third International Conference on Advances in Solidification Processes (ICASP 3) ; Conference date: 07-06-2011 Through 10-06-2011",

}

3D simulation of interdendritic flow through a Al-18wt.%Cu structure captured with X-ray microtomography. / Domitner, Josef; Hölzl, Christian; Kharicha, Abdellah et al.
2011. Poster session presented at Third International Conference on Advances in Solidification Processes (ICASP 3), Kerkrade, Netherlands.

Research output: Contribution to conference › Poster › Research › peer-review

TY - CONF

T1 - 3D simulation of interdendritic flow through a Al-18wt.%Cu structure captured with X-ray microtomography

AU - Domitner, Josef

AU - Hölzl, Christian

AU - Kharicha, Abdellah

AU - Wu, Menghuai

AU - Ludwig, Andreas

AU - Köhler, Markus

AU - Ratke, Lorenz

PY - 2011

Y1 - 2011

M3 - Poster

T2 - Third International Conference on Advances in Solidification Processes (ICASP 3)

Y2 - 7 June 2011 through 10 June 2011

ER -