15th International Conference on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2014

  • Katerina Macurova (Speaker)

Activity: Participating in or organising an eventParticipation in conference


Simulation of stress distribution in assembled silicon dies and deflection of printed circuit boards
Period7 Apr 20149 Apr 2014
Event typeConference
LocationGent, BelgiumShow on map