@inproceedings{d294c95c9bb24fe7abd29bc38b5747a2,
title = "Influence of environmental factors like temperature and humidity on MEMS packaging materials.",
keywords = "hygro-thermo-mechanical simulation, hygroscopic swelling, moisture diffusion, Thermo-mechanical characterization",
author = "Mahesh Yalagach and Fuchs, {Peter Filipp} and Ivaylo Mitev and Thomas Antretter and Michael Feuchter and Archim Wolfberger and Tao Qi",
year = "2018",
month = nov,
day = "26",
doi = "10.1109/ESTC.2018.8546484",
language = "English",
booktitle = "2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",
note = "7th Electronic System-Integration Technology Conference, ESTC 2018 ; Conference date: 18-09-2018 Through 21-09-2018",
}