Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards

Titel in Übersetzung: Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards

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Titel in Übersetzung	Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards
Originalsprache	Englisch
Publikationsstatus	Veröffentlicht - 2010
Veranstaltung	Electroceramics XII - Trondheim, Norwegen Dauer: 13 Juni 2010 → 16 Juni 2010

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@conference{0f170016d9874e0ea59d67cde9031d74,

title = "Characterisation and modelling of the mechanical reliability of semiconductor components for Printed Circuit Boards",

author = "{Bermejo Moratinos}, Raul and Marco Deluca and martin pletz and Peter Supancic and Robert Danzer",

year = "2010",

language = "English",

note = "Electroceramics XII ; Conference date: 13-06-2010 Through 16-06-2010",

}